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FluxAnvil焊艺砧
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Soldering craft & rework

FluxAnvil 焊艺砧

Each row is a technique with its measured parameters. Move the two sliders to narrow the bench by tip temperature and dwell time; the numbers come straight from the cards.

cards live
18/22
Scheduled ahead
4
Tip temperature span
300–400°C
Dwell span
0.5–4.0s

Bench filters

300 °C
4.0 s
18 cards shown
Every card on one scroll
Technique Tip Tip °C Dwell s Flux Alloy
Through-hole 7 / 8
Hook splice on stranded wire THT conical 1.6 mm 330 2.5 ROL0 no-clean Sn63Pb37
Soldering a pad tied to an internal ground plane THT chisel 3.2 mm 400 4.0 ROL1 mildly activated SAC305
Drag soldering a 0.1 in header THT hoof 2.0 mm 360 1.2 ROL1 mildly activated Sn63Pb37
Diagnosing and repairing a cold joint THT chisel 2.4 mm 340 2.5 ROL0 no-clean SAC305
Wick cleaning a through-hole pad without lifting it THT knife 3.2 mm 350 1.5 RMA rosin mildly activated Sn63Pb37
Vacuum desoldering a through-hole part THT chisel 3.2 mm 380 3.0 RMA rosin mildly activated Sn63Pb37
Through-hole fillet baseline THT chisel 2.4 mm 340 2.0 ROL0 no-clean SAC305
Surface mount 7 / 10
Dead-bug wiring a TSSOP SMD conical 0.2 mm 300 0.8 ROL0 no-clean SAC305
Dragging a 0.5 mm pitch QFP and clearing bridges SMD hoof 1.2 mm 350 1.2 ROL1 mildly activated SAC305
Two-iron removal of a 0805 chip SMD knife 2.0 mm 330 1.5 ROL0 no-clean SAC305
Fixing tombstoned 0603 and 0805 parts SMD conical 0.8 mm 310 1.0 ROL0 no-clean SAC305
Tip tinning, storage and end-of-day care SMD chisel 2.4 mm (care applies to all geometries) 300 0.5 ROL1 mildly activated Sn63Pb37
Drag soldering a SOIC-8 with gel flux SMD hoof 2.0 mm 340 1.5 ROL1 mildly activated SAC305
Hand-placing a 0402 passive SMD conical 0.4 mm 320 1.0 ROL0 no-clean SAC305
Array packages 4 / 4
Depositing paste on a BGA footprint with a mini stencil BGA chisel 2.4 mm (for stencil cleaning, not for soldering) 300 1.0 ROL1 mildly activated SAC305
Wicking and dressing a BGA pad field BGA knife 2.0 mm 360 1.5 ROL1 mildly activated Sn63Pb37
Corner-tack placement before BGA reflow BGA conical 0.4 mm 340 1.0 ROL1 mildly activated SAC305
Hot-air reflow profile for a 0.8 mm BGA BGA chisel 3.2 mm (for pad dressing, not for the reflow itself) 380 3.0 ROL1 mildly activated SAC305

Rows link to the full card. Scheduled cards appear here on their publish date.